K4A8G165WC-BCTD00P

Introduction

Key Features

• High-speed DDR4 architecture: 8Gb (1GB) capacity with 512M × 16-bit organization, 8 banks (2 bank groups) for efficient memory access and bandwidth utilizationSamsung Semiconductor Global
• Data transfer performance: up to 2666Mbps (DDR4-2666) data rate with 1.333GHz clock frequency for seamless multitasking and high-throughput applicationsSamsung Semiconductor Global
• Standard DDR4 voltage: 1.2V (1.14V~1.26V operating range) for optimized power efficiency compared to previous DDR3 generation (1.5V)
• Low-power design: supports multiple power-saving modes (including deep power-down) and temperature-compensated self-refresh (TCSR) for extended battery life in portable devices
• High-reliability features: built-in ECC (Error Correction Code) support for data integrity, and commercial-grade temperature tolerance (0°C to +85°C)Samsung Semiconductor Global
• Compact form factor: 96-pin FBGA package enabling space-efficient PCB layouts in slim and compact devicesSamsung Semiconductor Global
• Read-while-write capability: dual-bank group architecture allows simultaneous read and write operations for improved system responsivenessdownload.semiconductor.samsung.cn
• RoHS compliant: lead-free and halogen-free packaging meeting environmental protection standards
• JEDEC standard compliance: fully compatible with industry-standard DDR4 SDRAM specifications for seamless integration with mainstream memory controllers
• Product status: Mass Production - actively manufactured and available through authorized distributorsSamsung Semiconductor Global

Typical Applications

• Industrial automation controllers and PLCs requiring high-speed data processing and multitasking capabilities
• IoT gateways and edge computing nodes with high-bandwidth sensor data acquisition and real-time analytics
• Smart medical devices (portable diagnostic instruments, patient monitoring systems) requiring low power consumption and reliable memory performance
• Automotive infotainment systems, ADAS (Advanced Driver Assistance Systems) and vehicle control units (VCUs)
• High-end consumer electronics (smartphones, tablets, VR/AR devices, ultra-thin laptops) with slim design requirements
• Digital signage and human-machine interface (HMI) systems with high-resolution graphics rendering needs
• Communication equipment (routers, switches, 5G base stations) requiring high-speed memory access for packet processing
• Embedded vision systems and image processing modules with large data throughput requirements
• Battery-powered portable devices (wearables, handheld scanners, industrial field devices) needing optimized power efficiency
• Smart home appliances and hubs with multimedia processing capabilities and compact form factors